The Marvell Nanofabrication Laboratory (NanoLab) on the UC Berkeley campus features over 15,000 square feet of Class 100 and 1000 cleanroom space. It offers academic and industrial researchers comprehensive micro- and nanofabrication capabilities supported by expert equipment and process engineering staff. Complementing this, the NanoLab Machine Shop at Cory Hall delivers specialized engineering, design, and precision fabrication services for custom instrumentation and fixturing.

Email process@silicon.eecs.berkeley.edu to go over the specific materials or processes you would like to use.

General Overview

Wet Chemical Processing

In House Mask-Making Services

Lithography

Thermal Processing

Thin Film Deposition

Etching Systems

Metrology

Bonding & Packaging

Planarization

1.  General Information

1.1  (chp) Chemical Hygiene Plan

1.2   NanoLab Orientation Videos

1.3   How to Qualify on Equipment

1.4   Materials Control and Compatibility

1.5   NanoLab Tool Substrate Compatibility (4" / 6" / 8")

1.6   Chemical/Labware Guidelines

1.7   How to Make a Reservation

1.8   How to be a Lab Buddy

1.9   How to Write a Lab Manual

2.  Wet Chemical Processing

2.0  (sinkclass) Sink Class and Overview of Sink Information

2.01   Msink Summary Table

2.1  (msink1) Photoresist Strip & Pre-Furnace Metal Clean Sink

2.2  (msink2) Metal contaminated PR Strip Sink

2.3  (msink3) Manual Spin Coat & Develop Sink

2.4  (msink4) KOH and TMAH Silicon Etch

2.5  (msink5) Refractory Metal Processing Sink

2.6  (msink6) VLSI MOS Clean

2.7  (msink7) msink7 Acid/base batch processing

2.8  (msink8) Non-MOS clean

2.9  (msink9) Acid/base batch processing

2.12  (msink12) III-V Processing Sink

2.14  (msink14) Amatepi MOS Sink

2.16  (msink16) General Purpose Sink

2.18  (msink18) General Purpose Sink

2.19  (msink19) Electroplating Sink

2.20  (msink20) Diamond Seeding and The Lift-Off Process (General Solvent Sink)

2.21  (cpd) Tousimis 915B Critical-Point Dryer

2.22  (cpd2) Tousimis 815 Critical-Point Dryer (small samples)

3.  Mask Making

3.1   General Mask Making

3.4  (gcapg) GCA 3600 Pattern Generator

3.6  (aptchrome) APT Chrome Mask Process

4.  Photolithography

4.0  (lithoclass) Lithography Class

Exposure Tools

4.1  (uvflood) Dymax 2000 UV Flood System

4.2  (ksaligner) Karl Suss MA6 Mask Aligner

4.3  (gcaws6) GCA8500 Wafer Stepper (6")

4.4  (mla150) Heidelberg MLA150 Maskless Aligner

4.5  (asml300) ASML DUV Stepper Model 5500/300

E-Beam Lithography

4.10  (eblclass) Electron Beam Lithography Class

4.11  (crestec) Crestec CABL-9510CC Electron Beam Lithography System

4.12  (crestec130kv) Crestec CABL-UH Series Electron Beam Lithography System

Photoresist Coat/Develop

4.21  (svgcoat3) SVG 8626 6" Lift -Off resist and BARC Coat Track

4.22  (svgcoat6) SVG 6" Spin Coater

4.23  (svgdev6) SVG 6" Developer

4.24  (picotrack1) Picotrack Coater System

4.25  (picotrack2) Picotrack Developer System

4.26  (headway1) Headway Manual Load Photoresist Spinner at msink3

4.27  (headway2) Headway Stand-Alone Manual Load Photoresist Spinner

Others

4.31  (primeoven) HMDS vapor prime oven

4.32  (matrix) Matrix 106 Resist Removal System

4.34  (axcelis) Fusion M200PCU Photostabilizer System

4.35  (asap-liftoff) ASAP-Liftoff M6100

5.  Thermal Processing

Furnaces

5.0   Tystar Furnaces Overview

5.1  (tystar1) Tystar1 MOS Gate Oxidation Atmospheric

5.2  (tystar2) Tystar2 MOS Dry/Wet Oxidation & Anneal Atmospheric

5.3  (tystar3) Tystar3 NON-MOS Dry/Wet Oxidation & Anneal Atmospheric

5.4  (tystar4) Tystar4 Atmospheric Dry/Wet Oxidation (NON-MOS)

5.5  (tystar5) Tystar 200mm Wet/Dry Oxidation

5.6  (tystar6) Tystar 200mm N-Type Doping

5.7  (tystar7) Tystar 200mm P-Type Doping

5.9  (tystar9) Tystar9 non-MOS Clean Silicon Nitride (Si3N4) and SiC LPCVD

5.10  (tystar10) Tystar10 MOS Clean Polycrystalline Silicon LPCVD

5.11  (tystar11) Tystar11 MOS Clean LTO LPCVD

5.12  (tystar12) Tystar12 Non-MOS Clean LTO LPCVD

5.14  (tystar14) Tystar14 MOS 200mm LPCVD Nitride and HTO

5.15  (tystar15) Tystar15 200mm Non-MOS Poly-Si LPCVD

5.16  (tystar16) Tystar16 Non-MOS 200mm LTO LPCVD

5.17  (tystar17) Tystar17 Non-MOS Low Stress Nitride & High Temp. Oxide LPCVD

5.18  (tystar18) Tystar18 MOS Clean Aluminum Sintering Atmospheric

5.19  (tystar19) Tystar19 MOS Clean Si-Ge LPCVD

5.20  (tystar20) Tystar20 Non-MOS Clean Si-Ge LPCVD

5.22  (vcselox) AET GaAs/AlGaAs Oxidation Furnace

Rapid Thermal Annealers

5.30   RTP Overview

5.31  (rtp1) AccuThermo AW610 RTP for III/V or PZT

5.32  (rtp2) AccuThermo AW610 RTP III/V -no metal

5.33  (rtp3) AccuThermo AW610 RTP Si Non-MOS

5.34  (rtp4) AccuThermo AW610 RTP Si MOS Clean

5.35  (rtp8) AccuThermo AW810 RTP Si MOS Clean

Ovens

5.36  (vacoven) YES Vacuum Oven

5.37  (vacoven2) Small Vacuum Oven for Polymer Curing

5.38  (vacoven3) Small Vacuum Oven for Low Temperature Anneal

6.  Thin Film Systems

Vacuum Class

6.00  (vacuumclass) Vacuum Basics Class

Sputterers

6.10   Sputter Equipment Overview Table

6.12  (aln2) Endeavor AT

6.13  (ast-sputter) Multi Target Co-Sputtering System

6.14  (mrc943) MRC Sputtering System for Superconducting Films

6.15  (mrc944) MRC Sputtering System with Sputter-Etch

6.16   Oxford PVD & PECVD Common Manual

6.17  (oxfordpvd1) Oxford Plasmalab System100 Sputter Chamber 1

6.19  (sem-coater) SEM Sample Preparation Sputterer

6.20  (semicore) Pro450 Multi-Target Co-Sputter with Load Lock

Evaporator

6.30   Evaporator Overview Chart

6.31  (evapclass) Evaporator Training Class

6.32  (ast-ebeam) AST Electron Beam Dielectric Deposition

6.33  (cha) CHA Solution E-Beam Evaporator

6.34  (ebeam1) Electron Beam 10 kW 6-pocket Evaporator

6.35  (nrc) NRC Evaporator

6.36  (ultek2) Ultek2 Angled Cooled Chuck E-Beam Evaporator

Atomic Layer Deposition

6.40   ALD Overview Chart

6.41  (cambridge) Cambridge ALD Deposition System

6.42  (picosun) Picosun Atomic Layer Deposition (ALD)

Chemical Vapor Deposition

6.51  (amatepi) Applied Materials Epi Si & Ge Deposition

6.53  (oxford2) Oxford Plasmalab 80plus PECVD System

6.54  (oxfordpecvd3) Oxford Plasmalab System 100 PECVD System

6.55  (oxfordpecvd4) Oxford Plasmalab System 100 PECVD System

6.56  (parylene) Parylene Deposition System 2010 Labcoater 2

6.57  (pqecr) Plasma Quest ECR PECVD System

6.58  (sp3) sp3 HFCVD Diamond Deposition Reactor

7.  Etching Systems

7.0   Nanolab Etchers Overview

7.1  (etchclass) Plasma Etch Training Class

Vapor Etch

7.11  (xetch) Xenon Difluoride Etching System

7.12  (primaxx) uEtch HF Vapor Release System

Plasma Etch

7.21  (technics-c) Technics C Plasma Etching System

7.22  (yes-g500) YES-G500 Plasma Cleaning System

7.23  (centura-stri) Centura Microwave Plasma Asher

Reactive Ion Etch

7.31  (ptherm) Plasma-Therm Parallel Plate Etcher

7.32  (matrix-etch) Matrix Silicon Oxide/Nitride Etcher

7.33  (semi) SEMI RIE System

7.35  (centura-mxp) MxP+ Etch Chamber B

7.36  (oxford-rie) Oxford RIE System

Inductively Coupled Plasma with Bias

7.41  (lam7) Lam7 Metal (Al) TCP Etcher

7.42  (lam8) Lam8 Poly-Si TCP Etcher

7.43  (sts2) Surface Technology Systems (STS) Advanced Silicon Etch (ASE)

7.44  (sts-oxide) STS Advanced Planar Source Oxide Etch System

7.45  (centura-3-5) Compound Etch Chamber A

7.46  (centura-met) Metal Etch Chamber C

7.47  (oxford-icp) Oxford Plasmalab 100 ICP (Compound III-V)

Ion Mill

7.51  (ionmill6) Pi Scientific 6-inch Ion Beam Mill

8.  Testing & Inspection Equipment

Electrical Measurements

8.1  (cde-resmap) CDE ResMap Four Point Probe (automated mapper 2" -12")

8.2  (probe-eb8) Everbeing EB-8 Analytical Probe Station

8.3  (sca) Surface Charge Analyzer

Topography

8.10  (afmclass) Atomic Force Microscopy Class

8.11  (park-afm) Park Systems Atomic Force Microscope

8.12  (alphastep) KLA-Tencor Alpha-Step D-600 Profilometer

8.13  (dektak) Dektak 3030 Surface Profiler

8.14  (wyko) Wyko NT3300 Profiling System

Film Thickness and Index

8.20  (ellips) Gaetner Stokes Ellipsometer

8.21  (ellips2) Angstrom Sun Spectroscopic Ellipsometer

8.22  (metricon) Thin Film Thickness/Refractive Index Measurement System

8.23  (nanoduv) Nanometrics 210 XP Scanning UV Nanospec/DUV Microspectrophotomet

8.24  (nanospec) NanoSpec Film Thickness Measurement System

8.25  (nanospec-cmp) Nanospec/AFT Thin Film Measurement System

8.26  (msp300) Angstrom Sun MSP300 Microspectrophotometer

Structure and Composition

8.30  (edx) Oxford Instruments X-MaxN Energy-Dispersive Spectrometer

8.31  (flexus) Flexus Thin Film Stress Measurement

8.32  (ftir) Fourier Transform IR Spectrometer

8.33  (raman-scope) BaySpec Raman Spectrometer

8.34  (uvvis) UV-VIS Spectrophotometer

8.35  (xdif) Siemens D5000 X-Ray Diffractometer

8.36  (wafergauge) E+H Wafer Geometry Gauge

Surface Properties

8.40  (kruss) Contact Angle Measurement System

8.41  (tensiometer) Tensiometer (KSV Sigma 701)

IR Microscopy and Imaging

8.50  (ircam) IR Inspection Camera

8.51  (irscope) IR Microscope

Optical Microscopy and Imaging

8.60   Optical Microscopes

8.61  (keyence) Keyence VHX-500 Digital Microscope

8.62  (keyence7000) Keyence VHX-7000 Digital Microscope

8.63  (linewidth) Linewidth Measuring System

8.64  (linewidth2) Linewidth2 Zeiss Axioplan2 Measuring System

8.65  (olympus) Olympus LEXT OLS4000 3D Laser Confocal Microscope

8.66  (reichert) Reichert Microscope

UV Microscopy and Imaging

8.70  (uvscope) Leica INM100 Microscope

E-Beam Microscopy and Imaging

8.80  (semclass) Scanning Electron Microscopy Class

8.81  (zeiss-sem) Zeiss Scanning Electron Microscope

8.82  (zeiss-sem2) Zeiss 200 mm Scanning Electron Microscope

8.83  (fei-sem) FEI Nova NanoSEM 650 Scanning Electron Microscope

9.  Bonding & Packaging

9.1  (aml-bonder) AML AWB-08 Wafer Bonder

9.2  (finetech) Finetech Flipchip Bonder

9.3  (mesc) Eshylon Apache TTCS MESC Charging Station

9.4  (westbond) Westbond Wirebonder Model 7400B

9.6  (disco) Disco DAD3240 Automatic Dicing Saw

9.7  (die-expander) Dynatex DXE-5 Die Expander

9.8  (picosaw) Wafering Saw PICO-155P

10.  Planarization

10.1  (cmp) Strausbaugh CMP

10.2  (sinkcmp) CMP Wet Sink

10.3  (gnpcmp) GnP Poli 500 CMP

1.  General Information

1.1   Archived Process Manuals

1.2   How to Write a Process Manual

1.3   Blue & Gold Show Wafer Process

1.4   How to give a Nanolab orientation tour

1.5   Baseline CMOS Process

1.6   Processing of Glass Substrates

1.7   Stocked Tweezers

1.8   Stocked Beakers

1.9   Stocked Wafers

1.10   Administrative Quick Reference Guide

1.11   Tips and Tricks when Working with Small Samples

1.12   Chemical/Labware Guidelines

1.13   NanoLab Supplemental Process Data

2.  Sink Processes

2.1   Handle Wafer Bonding

2.2   Heated Water Bath Preparation

2.3   Silicon Nitride Membrane Fabrication

2.4   Photoresist Stripping of Wafers

2.5   General Labware Cleaning Procedures

2.6   Pocket Wafer Fabrication

2.7   Sol-gel PZT

2.9   VLSI Etchants

2.10   Miscellaneous Etchants

2.11  (msink19) Legacy Plating Solutions (From the archives)

3.  Mask Making

3.1   Mask Request Quick Steps

3.2  (asml300) ASML Reticle Design Guide

3.3  (gcaws6) GCAWS6 Reticle Design Guide

3.4   Iron Oxide Mask Processing

4.  Photolithography

4.10   Summary of Nanolab Photoresists

4.11   Recipe Names for Standard Lithography Processes

4.12   Process Tables for Nanolab Photoresists

4.13   Meander Generator

4.14  (asml300) ASML FEM Generator

4.15  (mla150) MLA150 FEM Generator

4.20   MiR 701 Photoresist Process

4.21   MiR 900 Photoresist Process

4.22   AZ 12xT Photoresist Process

4.23   AZ P4620 Photoresist Process (Legacy)

4.24   UV 26 Photoresist Process

4.25   UV 210 Photoresist Process

4.26   OCG 934 3:2 Developer Verification

4.27   SU8 Photoresist Process

4.30  (asml300) How to Run a Focus Exposure Matrix on the ASML 5500/300

4.31  (asml300) Demonstration of 150 nm Feature Resolution on ASML

4.32  (asml300) Running 4" Wafers on MESCs in ASML

4.40  (ksaligner) Chip Lithography on ksaligner

4.50   Mix & Match Process

4.60  (asap-liftoff) ASAP Process Acceptance Summary

4.61   Lift-Off Processing Guide

4.62   Image Reversal Processing Guide

4.70  (crestec130kv) PMMA Process Manual

4.71  (crestec130kv) CSAR Developer

5.  Thermal Processing

5.1   Working with Temperature Control with the RTP's

5.2  (tystar15) aSi LPCVD comparison Tystar10 and Tystar15

5.3  (tystar6) Tystar 6 N-Doping Characterization Summary

5.4  (tystar7) Tystar 7 P-Doping Characterization Summary

5.5   Low Stress Silicon Carbide Process

6.  Thin Film Systems

6.1   Changing a Crystal Monitor

6.2   PECVD Overview from Oxford Instruments

6.3  (oxfordpecvd4) PECVD SiOx Deposition with 81MHz Power

6.4  (oxfordpecvd4) PECVD SixNy Deposition with 81MHz Power

6.5  (evapclass) NanoLab Precious Metal Melt and Target Policies

6.6   ITO Prepared by Reactive Thermal Evaporation

7.  Etching Systems

8.  Testing and Inspection

8.1   Line and Surface Roughness Measurements with the Olympus

8.2  (ellips2) Spectroscopic Ellipsometer Model Analysis

8.3  (ftir) Introduction to FT/IR Measurements

8.4   LED Microscope Illumination Project

8.5  (msp300) Multi-layer Thin Film Color Calculator

9.  Packaging

9.1   Cleaving a Silicon Wafer

10.  Planarization

1.  General Information

2.  Cleaning Procedures

3.  Mask Making

4.  Photolithography

4.0   Archive of Lithography Process Specifications

4.10  (ksaligner) Lamp Intensity (i-line & g-line)

4.11  (ksaligner) MiR 701 Exposure Dose (1.0um & 2.0um)

4.12  (ksaligner) MiR 900 Exposure Dose (3.5um & 5.0um)

4.20  (svgcoat3) AR3-600 (BARC) (0.06 um)

4.30  (mla150) MiR 701 Exposure Dose and Focus (1.0um)

4.40  (picotrack1) Picotrack UV210 0.5 Thickness

5.  Thermal Processing

5.0   Tystar1-5 THERMAL OXIDE REPORT

5.1  (tystar1) 1GATEOXA - Gate Oxide

5.2  (tystar2) 2WETOXA - Wet Oxide

5.3  (tystar3) 3GATEOXA - Gate Oxide

5.4  (tystar5) 5WETOXA.005 - Wet Thermal Oxide

5.5  (tystar6) 6PHOSDOP1.006 - Phosphorus Doping and Diffusion Report

5.7  (tystar9) 9CH6SiA - Silicon Carbide

5.8  (tystar10) 10SDPLYC- Doped Polysilicon

5.9  (tystar10) 10SUPLYB - Undoped Polysilicon

5.10  (tystar11) 11SDLTON - Doped Low Temperature Oxide

5.11  (tystar11) 11SULTON - Undoped LTO

5.12  (tystar12) 12SDLTOP - Doped Low Temperature Oxide

5.13  (tystar12) 12SULTON - Undoped Low Temperature Oxide

5.14.1  (tystar14) 14SIN - Stoichiometric SiN

5.14.2  (tystar14) 14LSN - Low Stress Nitride

5.14.3  (tystar14) 14HTO - High Temperature Oxide

5.15.1  (tystar15) 15POLY.002 - Undoped PolySi

5.15.2  (tystar15) 15NDPOLYVAR.002 - Doped PolySi Standard

5.16  (tystar16_150mm) 16LTO - Undoped LTO

5.17  (tystar17) 17HTOSTDA - High Temperature Oxide

5.18  (tystar17) 17LSNSTDA - Low Stress Nitride

5.19  (tystar17) 17STDNITA - Standard Nitride

5.20  (tystar20) SIGENUCJ.020

Rapid Thermal Processing

5.21  (rtp3) RTP3-Dry Oxidation Monitor

5.22  (rtp4) RTP4-Dry Oxidation Monitor

5.23  (rtp8) RTP-8 Dry Oxidation Monitor

5.100   Archived Process Monitors Pre-2014

6.  Thin Film Systems

6.4  (mrc944) MRC944 Al/Si Deposition

6.22  (parylene) Parylene C Standard Deposition

6.24  (picosun) Picosun Al2O3 Deposition

6.25  (cambridge) Cambridge Fiji Al2O3 Deposition

6.51  (aln2) Aln2 PM1 Molybdenum Sputter Deposition

6.52  (aln2) Aln2 PM2 AlN Sputter Deposition

6.53  (aln2) Aln2 PM3 Aluminum Sputter Deposition

6.60  (oxfordpecvd3) Oxford PECVD3 - SiOx

6.61  (oxfordpecvd4) Oxford PECVD4 - SiOx

6.62  (oxfordpecvd4) Oxford PECVD4 - SixNy

6.63  (pqecr) PQECR- Oxide

7.  Etching Systems

7.0  (technics-c) Archived Etch Process Specifications

7.12  (primaxx) Primaxx Vapor HF Etch on Wet Thermal Oxide

7.34  (lam6) Lam6 Oxide Etch

7.35  (centura-mxp) Centura-MXP Oxide Etch

7.41  (lam7) Lam7 Aluminum Etch

7.42  (lam8) Lam8 Polysilicon Main Etch

7.43  (sts2) Surface Technology Systems (STS) Advanced Silicon Etch (ASE)

7.44  (sts-oxide) STS-Oxide Plasma Etch Monitor

7.46  (centura-met) Centura-MET Aluminum Etch

7.51  (ionmill6) Ionmill6 Etch Monitor

8.  Testing & Inspection Equipment

8.3.1  (cde-resmap) CDE ResMap 4.42 Ohm-cm Resistivity

8.3.2  (cde-resmap) CDE ResMap 0.0380 Ohm-cm Resistivity

8.5.1  (sca) SCA 2.87E14 cm-3 Nsc

8.11.1  (park-afm) Park AFM Noise Floor Measurement

8.20.1  (ellips) Ellips 1054 A SiO2 Thin Film

8.20.2  (ellips) Ellips 4455 A Si3N4 Thin Film

8.23.1  (nanoduv) Nanoduv 1054 A SiO2 Thin Film

8.23.2  (nanoduv) Nanoduv 4455 A Si3N4 Thin Film

8.24.1  (nanospec) Nanospec 1054 A SiO2 Thin Film

8.24.2  (nanospec) Nanospec 4455 A Si3N4 Thin Film

8.26  (msp300) MSP300 Oxide / Nitride thin film

8.60.1  (keyence) Keyence 20 um Pitch (500x)

8.60.2  (keyence) Keyence 5 um Pitch (1000x)

8.62  (keyence7000) Keyence 7000 10um pitch

8.63.1  (olympus) Olympus 1.8 um Step

8.63.2  (olympus) Olympus 12 um Pitch

9.  Packaging

10.  Planarization

10.1  (cmp) CMP oxide.std Removal Rate and non-Uniformity