Lithography

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NanoLab has multiple lithography solutions for device patterning, supporting a wide range of techniques. Our equipment includes flood exposure, contact alignment, i-line direct-write lithography, electron beam lithography (EBL), and deep-UV lithography, allowing us to accommodate patterning needs across various scales, from individual chips to full wafers.

Equipment Manual

4.  Photolithography
4.0  (lithoclass) Lithography Class
Exposure Tools
4.1  (uvflood) Dymax 2000 UV Flood System
4.2  (ksaligner) Karl Suss MA6 Mask Aligner
4.3  (gcaws6) GCA8500 Wafer Stepper (6")
4.4  (mla150) Heidelberg MLA150 Maskless Aligner
4.5  (asml300) ASML DUV Stepper Model 5500/300
E-Beam Lithography
4.10  (eblclass) Electron Beam Lithography Class
4.11  (crestec) Crestec CABL-9510CC Electron Beam Lithography System
4.12  (crestec130kv) Crestec CABL-UH Series Electron Beam Lithography System
Photoresist Coat/Develop
4.21  (svgcoat3) SVG 8626 6" Lift -Off resist and BARC Coat Track
4.22  (svgcoat6) SVG 6" Spin Coater
4.23  (svgdev6) SVG 6" Developer
4.24  (picotrack1) Picotrack Coater System
4.25  (picotrack2) Picotrack Developer System
4.26  (headway1) Headway Manual Load Photoresist Spinner at msink3
4.27  (headway2) Headway Stand-Alone Manual Load Photoresist Spinner
Others
4.31  (primeoven) HMDS vapor prime oven
4.32  (matrix) Matrix 106 Resist Removal System
4.34  (axcelis) Fusion M200PCU Photostabilizer System
4.35  (asap-liftoff) ASAP-Liftoff M6100

Process Manual

4.  Photolithography
4.10   Summary of Nanolab Photoresists
4.11   Recipe Names for Standard Lithography Processes
4.12   Process Tables for Nanolab Photoresists
4.13   Meander Generator
4.14  (asml300) ASML FEM Generator
4.15  (mla150) MLA150 FEM Generator
4.20   MiR 701 Photoresist Process
4.21   MiR 900 Photoresist Process
4.22   AZ 12xT Photoresist Process
4.23   AZ P4620 Photoresist Process (Legacy)
4.24   UV 26 Photoresist Process
4.25   UV 210 Photoresist Process
4.26   OCG 934 3:2 Developer Verification
4.27   SU8 Photoresist Process
4.30  (asml300) How to Run a Focus Exposure Matrix on the ASML 5500/300
4.31  (asml300) Demonstration of 150 nm Feature Resolution on ASML
4.32  (asml300) Running 4" Wafers on MESCs in ASML
4.40  (ksaligner) Chip Lithography on ksaligner
4.50   Mix & Match Process
4.60  (asap-liftoff) ASAP Process Acceptance Summary
4.61   Lift-Off Processing Guide
4.62   Image Reversal Processing Guide
4.70  (crestec130kv) PMMA Process Manual
4.71  (crestec130kv) CSAR Developer

Process Specifications

4.  Photolithography
4.0   Archive of Lithography Process Specifications
4.10  (ksaligner) Lamp Intensity (i-line & g-line)
4.11  (ksaligner) MiR 701 Exposure Dose (1.0um & 2.0um)
4.12  (ksaligner) MiR 900 Exposure Dose (3.5um & 5.0um)
4.20  (svgcoat3) AR3-600 (BARC) (0.06 um)
4.30  (mla150) MiR 701 Exposure Dose and Focus (1.0um)
4.40  (picotrack1) Picotrack UV210 0.5 Thickness