Metrology

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We provide an extensive array of metrology tools for thorough device characterization. Our analytical capabilities include electrical characterization, surface topography analysis (with atomic force microscopy - AFM), film thickness and optical property measurements, structural and compositional analysis, a range of high resolution optical microscopes, and scanning electron microscopy (SEM).

Equipment Manual

8.  Testing & Inspection Equipment
Electrical Measurements
Topography
Film Thickness and Index
Structure and Composition
8.33  (raman-scope) BaySpec Raman Spectrometer
8.36  (wafergauge) E+H Wafer Geometry Gauge
Surface Properties
8.41  (tensiometer) Tensiometer (KSV Sigma 701)
IR Microscopy and Imaging
8.50  (ircam) IR Inspection Camera
8.51  (irscope) IR Microscope
Optical Microscopy and Imaging
8.63  (linewidth) Linewidth Measuring System
8.66  (reichert) Reichert Microscope
UV Microscopy and Imaging
8.70  (uvscope) Leica INM100 Microscope
E-Beam Microscopy and Imaging

Process Specifications

8.  Testing & Inspection Equipment
8.5.1  (sca) SCA 2.87E14 cm-3 Nsc
8.24.1  (nanospec) Nanospec 1054 A SiO2 Thin Film
8.60.1  (keyence) Keyence 20 um Pitch (500x)
8.60.2  (keyence) Keyence 5 um Pitch (1000x)
8.62  (keyence7000) Keyence 7000 10um pitch
8.63.1  (olympus) Olympus 1.8 um Step
8.63.2  (olympus) Olympus 12 um Pitch


07/31/25