NanoLab provides both wafer bonding and wire bonding services for your packaging needs. We also offer mobile electrostatic chuck (MESC) technology to permit the processing of smaller dies on wafer-scale platforms. Die singulation is possible with a 200mm capable wafer dicing saw.
Equipment Manual
9. Bonding & Packaging
9.1 (aml-bonder) AML AWB-08 Wafer Bonder
9.2 (finetech) Finetech Flipchip Bonder
9.3 (mesc) Eshylon Apache TTCS MESC Charging Station
9.4 (westbond) Westbond Wirebonder Model 7400B
9.6 (disco) Disco DAD3240 Automatic Dicing Saw
9.7 (die-expander) Dynatex DXE-5 Die Expander
9.8 (picosaw) Wafering Saw PICO-155P
Process Specifications
9. Packaging