Physical Vapor Deposition

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Nanolab has extensive thin film vapor deposition capabilities. Our Physical Vapor Deposition options include magnetron sputtering (RF, DC, and HIPIMS), thermal evaporation, and electron-beam evaporation. Our Chemical Vapor Deposition(CVD) capabilities include Atomic Layer Deposition (ALD) , Plasma Enhanced CVD (PECVD) and Epitaxial Si and SiGe deposition. We also have some unique capabilities such as Diamond film CVD.

Process Specifications

6.  Thin Film Systems
6.24  (picosun) Picosun Al2O3 Deposition
6.60  (oxfordpecvd3) Oxford PECVD3 - SiOx
6.61  (oxfordpecvd4) Oxford PECVD4 - SiOx
6.62  (oxfordpecvd4) Oxford PECVD4 - SixNy
6.63  (pqecr) PQECR- Oxide


07/31/25