NanoLab is equipped with multiple chemical mechanical polishing (CMP) systems to process silicon, oxide layers, and metallic films.
Equipment Manual
10. Planarization
10.1 (cmp) Strausbaugh CMP
10.2 (sinkcmp) CMP Wet Sink
10.3 (gnpcmp) GnP Poli 500 CMP
Process Manual
10. Planarization