Wet Chemical Processing

Return to full list

NanoLab has a wide array of benches to serve your wet chemistry processing needs. Providing both ease-of-use baths for common solvent and acids, as well as flexible space for your unique needs, we can support your chemical processes whether you are working with small chips or 200 mm wafers.

Equipment Manual

2.  Wet Chemical Processing
2.0  (sinkclass) Sink Class and Overview of Sink Information
2.01   Msink Summary Table
2.1  (msink1) Photoresist Strip & Pre-Furnace Metal Clean Sink
2.2  (msink2) Metal contaminated PR Strip Sink
2.3  (msink3) Manual Spin Coat & Develop Sink
2.4  (msink4) KOH and TMAH Silicon Etch
2.5  (msink5) Refractory Metal Processing Sink
2.6  (msink6) VLSI MOS Clean
2.7  (msink7) msink7 Acid/base batch processing
2.8  (msink8) Non-MOS clean
2.9  (msink9) Acid/base batch processing
2.12  (msink12) III-V Processing Sink
2.14  (msink14) Amatepi MOS Sink
2.16  (msink16) General Purpose Sink
2.18  (msink18) General Purpose Sink
2.19  (msink19) Electroplating Sink
2.20  (msink20) Diamond Seeding and The Lift-Off Process (General Solvent Sink)
2.21  (cpd) Tousimis 915B Critical-Point Dryer
2.22  (cpd2) Tousimis 815 Critical-Point Dryer (small samples)

Process Manual

2.  Sink Processes
2.1   Handle Wafer Bonding
2.2   Heated Water Bath Preparation
2.3   Silicon Nitride Membrane Fabrication
2.4   Photoresist Stripping of Wafers
2.5   General Labware Cleaning Procedures
2.6   Pocket Wafer Fabrication
2.7   Sol-gel PZT
2.9   VLSI Etchants
2.10   Miscellaneous Etchants
2.11  (msink19) Legacy Plating Solutions (From the archives)

Process Specifications

2.  Cleaning Procedures


07/31/25