Short loop #2a: PSG drive out test short loop (quick check)
Step	Process name	Specification/Measurement results	Equipment	Comment	Operator/Date
0.0	Wafer	P-type, prime grade, 38-63 Ohm-cm		4 wafers	horvath/09-18-03
1.0	Bulk resistivity measurement				horvath/09-18-03
1.1	Pre-clean	Piranha clean and HF dip wafers	Sink9
1.2	Measure sheet resistance	w#1: ~600 700 550 800 750 Ohm/sq	4ptprb	Approximate values (high resistivity)
		w#2: ~1070 1000 1540 710 900
		w#3:~ 500 570 570 570 390
		w#4: ~470 600 700 600 500
2.0	PSG deposition	Recipe: 11SDLTOA, 12 min. dep. Time	Tystar11		horvath/09-18-03
2.1	Measure PSG thickness	w#1: 1764 1688 1672 1696 1675 A	Nanoduv
		w#2: 1772 1677 1667 1687 1670
		w#3: 1762 1664 1663 1678 1656
		w#4: 1756 1600 1658 1675 1657
3.0	Backside PSG etch			Necessary for accurate temperature set up during RTA	horvath/09-18-03
3.1	Wafer coating	Coat wafers with PR on front	SVGCOAT6
3.2	Hard bake	Hard bake resist	UVBAKE
3.3	PSG etch	5/1 BHF dip wafers	Sink7
3.4	Resist strip	Ash resist in O2 plasma	Matrix
3.5	Cleaning	Std. Piranha clean MEMS and MOS clean	Sink9
4.0	RTA	w#1 950C 10 sec	Heatpulse3		horvath/09-19-03
		w#2 950C 20 sec
		w#3 950C 30 sec
		w#4 950C 50 sec
5.0	Bulk resistivity measurement				horvath/09-19-03
5.1	PSG etch	Dip wafers into 25/1 HF	Sink9
5.2	Measure sheet resistance	w#1 685 760 617 820 750 Ohm/sq	4ptprb
		w#2 510 460 435 488 480
		w#3 400 397 340 410 370
		w#4 340 340 320 340 320