Run Card for FlexFET process

 

 

Step 65. Aluminum etch      

 

 

 

Steps

Notes

Date

Operator

 

65.1

 

 

2 steps etch:

 

-          BARC etch in Centura: MXP_BARC_ETCH, 40 sec (approx. 800-900A UV210 PR is etched)

-          Al etch in Lam3: Monitoring recipe (no overetch):

a)     Silicided wafers: 65 sec etch time

b)     Implanted wafers: 75 sec etch time

 

08/11/04

Horvath