Step 64. M1 photo
|
Steps |
Notes |
Date |
Operator |
|
64.1 |
Standard DUV litho with
BARC: PM mark signals are very
weak, need recovery: -
Open up PM
dies on every wafer -
BARC etch in Centura: MXP_BARC_ETCH recipe, 40 sec -
Wet etch Al in
Sink8 until gone (~1min) Note: F#2 required further
treatment: Lam3 Al etch followed by MXP_OXSP_ETCH.
Finally got aligned on 8/13/04 and further process completed on 8/16/04. Ash and recoat wafers with
BARC+UV210 resist ASML: -
Energy-focus
matrix to determine best exposure settings -
Expose every
wafer with 32mJ at -1.1um focus offset Hard bake: UVBAKE, pr.J |
08/10/04 |
Horvath |