Step 60. Contact photo
|
Steps |
Notes |
Date |
Operator |
|
60.1 |
Standard DUV litho without
BARC: ASML: -
Energy-focus
matrix to determine best exposure settings -
Expose
implanted wafers with 45mJ at -1.1um focus offset -
Expose silicided wafers with 47mJ at -1.1um focus offset Slightly over-exposed the
wafers to ensure contact hole opening. Note: F#2 was misaligned, had
to open up PM dies and etch the top layer (MXP_OXSP_ETCH 3 min). Wafer got aligned after
the cleaning. Hard bake: Oven bake at
120C for 1hr |
08/4/04 |
Horvath |