Run Card for FlexFET process

 

 

Step 56. M0 deposition (PVD TiN and LPCVD PolySi)

 

 

 

Steps

Notes

Date

Operator

 

56.1

 

 

TiN deposition in Novellus:

 

-          Sputter etch 1 min. ETCHSTD recipe

-          Deposition using TiN600ST recipe (60 sec dep. time)

 

Note: w#10 was broken inside the tool due to transfer arm alignment failure

 

Process on w# 12, 13 and 14 was done on 07/20/04 after tool had been fixed.

07/15/04

07/20/04

Horvath

 

 

56.2

 

 

 

Poly-Si deposition in Tystar 16:

 

-          Rinse wafers

-          Recipe 16SDPLYB, 6 hours 30 min.

-          Including 4 TEOS dummies and 1 TEOS + patterned + etched + TiN test wafer

 

 

Poly thickness on dummies (on 5200A TEOS):

 

Test Wafer

T

C

F

L

R

# 16

6606

6765

7129

6669

6784

# 17

6897

7015

7318

6985

7070

# 18

6872

6888

7223

6910

6866

# 15*

6888

6783

6917

6611

7070

 

*: Poly deposition on test w#15 and product wafers # 12, 13, 14 was done separately on 07/21/04

 

 

7/16/04

7/21/04

Horvath