Run Card for FlexFET process

 

 

Step 53. Gate contact (M0) photo  

 

 

 

Steps

Notes

Date

Operator

 

53.1

 

 

Standard DUV litho without BARC:

 

ASML:

-          Energy-focus matrix to determine best exposure settings

-          Expose all wafers with 39mJ at -1.3um focus offset

 

Hard bake: Oven bake at 120C for 1hr

 

 

07/12/04

Horvath