Run Card for FlexFET process

 

 

Step 51. TEOS oxide STI deposition

 

 

 

Steps

Notes

Date

Operator

 

51.1

 

 

First TEOS deposition and etch back in P-5000:

 

Target 5500A:

-          110 sec deposition time (dep. rate~80A/sec)

-          120 sec etch back time (etch rate~30A/sec)

 

 

Thickness on dummies (Nanoduv, program: Oxide on Si)

T: 5021A  4896A

C:5322A  5130A

F: 5370A  5171A

L: 5374A  5176A

R: 5194A  5003A

 

 

 

07/01/04

 

Horvath

 

 

51.2

 

 

 

Second TEOS deposition and etch back in P-5000:

 

Target 3500A additional TEOS:

-          90 sec deposition time

-          120 sec etch back time

 

 

Thickness of this deposition:

 

T: 3606A

C: 3918A

F: 3869A

L: 3863A

R: 3693A

 

Total TEOS thickness (on dummies):

 

T: 8507A 8330A

C: 8933A 8740A

F: 8927A 8750A

L: 9015A 8793A

R: 8568A 8453A