Run Card for FlexFET process

 

 

Step 5.0 Zero layer photo

 

 

 

Steps

Notes

Date

Operator

 

 

 

 

5.1

 

Standard DUV litho with BARC*

Exposure energy 45 mJ/cm2, Combi reticle

Hard bake at 120 C for 60 min

 

11/24/03*

Horvath

5.2

 

Final zero layer positions in ASML FlexFET job:

(-42.0; 3.0) (42.0; 3.0) (3.0; 68.5) (3.0; -59.5)

mm in wafer coordinates.

Backup zero layer positions:

(-45.0; 3.0) (45.0; 3.0) (0.0; 68.5) (0.0; -59.5)

mm in wafer coordinates

 

11/24/03

Horvath

 

*: Litho steps for etching trials were made on 10/27/03, 10/29/03, 10/30/03, 11/04/03, 11/18/03. Those steps were standard DUV litho steps without BARC.