Run Card for FlexFET process

 

 

Step 47b. TiN plus Poly-Si topgate deposition    

 

 

 

Steps

Notes

Date

Operator

 

47b.1

 

 

Wafers # 2, 3, 6, 10, 14.

TiN deposition in Novellus: TiN600ST recipe (60 sec. dep. time)

Poly-Si deposition in Tystar16: 16SDPLYB, 40 min dep. time, target=600A

 

Note:

Poly deposition was required on TiN because TiN film was not continuous on surface steps.

 

 

6/15/04

and

6/19/04

Horvath