Run Card for FlexFET process

 

 

Step 45. Sacrificial oxide strip and clean

 

 

 

Steps

Notes

Date

Operator

 

45.1

 

 

Try w#5 in 25/1 HF for 1 min.

Looked good under SEM, although applying the shorter time the better to prevent exposed TiSi2.

 

-          Silicided wafers: 35 sec 25/1 HF

-          Implanted wafers: 60 sec 25/1 HF

 

6/13/04

Horvath