Run Card for FlexFET process

 

 

Step 4.0 Wet strip sacrificial oxide

 

 

 

Steps

Notes

Date

Operator

 

 

 

 

4.1

 

Wet etch ~1000A SiO2 from thin SOI wafers in Sink6 25/1 HF solution for ~ 9 min (until dewet)

 

10/27/03

Horvath