Run Card for FlexFET process

Step 34. NMOS bottom gate and Vt adjust implants

Steps

Notes

Date

Operator

34.1

Triple implant on every wafer at Core Systems:

Wafer	Specie	Dose	Energy
Every wafer	Boron	5E13	40
Every wafer	Indium	1E14	195
F#2, 3, 6, 7, 10, 14	As	5E12	16
F#5, 9, 12, 13	BF2	5E12	16

Wafers were sent to Core Systems on 5/10/04; back on 5/10/04 (expedited implantation).

05/10-13/04

Horvath