Run Card for FlexFET process

 

 

Step 31. BSG spacer deposition

 

 

 

Steps

Notes

Date

Operator

31.1

 

-          30 sec 25/1 HF dip implanted S/D wafers prior deposition (no HF dip for silicided wafers)

 

-          BSG deposition: P-5000, 18 sec. dep. time

 

-          BSG thickness measurement (Nanospec):

 

W#7: 1540A

W#3: 1560A

 

 

05/06/04

Horvath