Run Card for FlexFET process

 

 

Step 3.0 Grow thick sacrificial oxide on thin SOI wafers

 

 

 

Steps

Notes

Date

Operator

 

 

 

 

3.1

 

Standard MOS piranha clean thin SOI wafers in sink6 + 25/1 HF dip until dewet

Include 2 dummies for oxide thickness measurement

 

10/23/03

Horvath

3.2

 

2 hrs TLC clean Tystar2

 

10/23/03

Horvath

3.3

 

Wet oxidation in Tystar2: recipe 2WETOXA, 1000°C, 10min.

 

10/23/03

Horvath

3.4

 

Measure oxide thickness on dummies using Nanoduv:

 

10/23/03

Horvath

T

C

F

L

R

1030

1059

1067

1041

1059

1014

1030

1043

1030

1033