Run Card for FlexFET process

Step 19b Nitride pad etch on Silicided wafers

Steps

Notes

Date

Operator

19b.1

Silicided wafers only:

F# 2, 5, 6, 9, 10, 12.

a) Nitride etch in Applied Centura:

Recipe: MXP_NITR_PRCS

Etch time: 70sec + 5sec in the overetch step

b) Resistance measurement with a manual probe station on etched areas (Ti underneath)

	Resistance
F#2	27 Ohm
F#5	26 Ohm
F#6	26 Ohm
F#9	25 Ohm
F#10	28 Ohm
F#12	25 Ohm

03/04/04

Horvath