Run Card for FlexFET process

 

 

Step 18b Active are photo on Silicided wafers

 

 

 

Steps

Notes

Date

Operator

18b.1

 

Silicided wafers only:

F# 2, 5, 6, 9, 10, 12, 15.

 

Std. litho step with BARC:

 

ASML:   Mask: ACTIVE (FlexFET1 reticle).    Energy meander test : 110mJ was the best exposure energy. Exposed all the wafers with 110mJ.

 

Develop: 0.35um was open on every wafer.

 

Hard Bake: @ 120°C oven for 1 hour.

 

 

03/01/04

Horvath