Run Card for FlexFET process

 

 

Step 18a Active are photo on imp. S/D wafers

 

 

 

Steps

Notes

Date

Operator

18a.1

 

Implanted S/D wafers only:

F# 1, 3, 7, 8, 11, 13, 14.

 

Std. litho step with BARC:

 

ASML:   Mask: ACTIVE (FlexFET1 reticle).    Energy meander test on F#13: 44mJ was the best exposure energy. Exposed all wafers with 44mJ.

Develop: 0.35um was open on every wafer.

Hard Bake: @ 120°C oven for 30 min.

 

 

12/18/03

Horvath