Run Card for FlexFET process

 

 

Step 16.0 Implanted S/D activation

 

 

 

Steps

Notes

Date

Operator

16.1

 

Implanted S/D wafers only:

F# 1, 3, 7, 8, 11, 13, 14.

+ 2 implant test wafers

 

Std. MOS clean wafers piranha in sink9 (no HF dip)

 

 

12/16/03

Horvath

15.2

 

Rapid thermal annealing in Heatpulse3.

Recipe:

-         450 °C, 30 sec

-         1000 °C, 10 sec

 

12/16-17/03

Horvath

 

Note: Implantation caused colorization faded away after the RTA.