Run Card for FlexFET process

 

 

Standard process steps

 

 

Steps

Process details

 

 

Standard piranha clean

 

1. H2SO4 + 100ml H2O2 at 120 °C for 10 min

2. 2 cycles of DI water quick dump rinse

3. Spin dry

 

Standard DUV litho with BARC coating

 

BARC coating

Tool: SVGCOAT6 (SVG8800)

BARC type: Shipley AR3-600

Target thickness: ~ 600Å

Process: 1. Spin at 3750 RPM for 30 sec (hand dispense)

2. Soft bake at 205 C for 60 sec; proximity bake

 

Resist coating

Tool: SVGCOAT6 (SVG8800)

Resist: Shipley UV-210

Target thickness: 9000A

Process: 1. HMDS prime at 100 C for 60 sec (skip if BARC used)

2. Spin resist at 1480 RPM for 30 sec

3. Soft bake at 130 C for 60 sec; proximity bake

Exposure

Tool: ASML 5500/90

Energy: Tbd for each process step

 

Resist developing

Tool: SVGDEV6 (SVG8800)

PEB: 130 C for 60 sec; contact bake

Developer: LDD-26W for 45 sec

 

Hard bake

Oven bake at 120 C for 30 min or UVBAKE pr. J