Split point #1 Thick SOI vs.
Thin SOI
|
Steps |
Notes |
Date |
Operator |
|
|
|
|
|
|
|
Thick SOI wafers: F#2, 7,
8, 9, 10, 13, 14, 15 |
10/23/03 |
Horvath |
|
|
Thin SOI wafers: F#1**, 3,
4*, 5, 6, 11, 12 |
10/23/03 |
Horvath |
*: Wafer F#4 became useless
after resist burn in Lam4 during the PM etch (on
11/10/03)
**: Wafer F#1 was moved to
the Thin SOI group after the loss of F#4