Step 35.  LDD spacer etch

Step	Process	Date	Operator
35.1	TEOS blank etch in Centura: Recipe: MXP_OXSP_ETCH Etch rate: 3000-3100A/min Manual endpoint etch when endpoint signal drops. Etch time 79-82 sec. No oxide could be measured on active area.	11/02/04	Horvath