Step 25. PMOS Vt adjustment implant photo

 

 

 

 

Step

 

Process

Date

Operator



25.1
 
  Inspect wafers after implantation.
  Remove PR in Matrix
  Piranha clean in MEMS Sink8



09/16/04


Horvath

 

25.2

 

 

Std. DUV litho

ASML: mask NWELL, 25mJ, 0um focus offset

Hard bake: UVBAKE pr. J

Note: Due to ASML laser problems w#1, 5 partially double exposed, w#7 completely double exposed (no image turned out after first exposure). All wafers look good.

 

09/16/04

Horvath