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Run Card for cmos150 |
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Step 40.0 |
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Process: Metal Photo: Mask METAL1-CM (M1 chrome-clear field) |
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Operator |
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Standard Lithography Process |
May 2, 2002 |
vorosl |
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1. |
HMDS |
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Program: 1 on svgcoat6 |
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2. |
Spin and Soft Bake |
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Program: 1 and 1 on svgcoat6 |
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Photoresist: UV210-0.6 (Shipley) |
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Thickness of PR: 7000 A (RPM=2000) |
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3. |
Expose by ASML: METAL1 mask |
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Run Focus-Energy matrix. best die: 17 mJ/cm2 Mask window size increased to 39 mm in X and Y. Note: Without ARC (anti reflective coat) really difficult to manage the printing of the long narrow lines. Lifting. |
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4. |
Post exposure bake (Program: 1) |
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5. |
Develop (Program: 1) |
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svgdev6 |
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6. |
Inspect |
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7. |
Descum |
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This step was skipped since there was no 6” tool for it |
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8. |
Hard Bake |
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UVBAKE: program “J” |
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