Run Card for cmos150

 

Step 36.0

 

 

 

 

 

Process: Contact Photo: Mask CONT (CONT chrome-df)

Date

Operator

 

 

 

 

 

Standard Lithography Process

April 23rd , 2002

vorosl

 

 

 

1.

HMDS

 

 

 

Program: 1 on svgcoat6

 

 

 

 

 

 

2.

Spin and Soft Bake

 

 

 

Program: 1 and 1 on svgcoat6

 

 

 

Photoresist: UV210-0.6 (Shipley)

 

 

 

Thickness of PR: 7 000 A (RPM: 2000)

 

 

 

 

 

 

3.

Expose by ASML: Contact mask

 

 

 

#3 exposed with 20 mJ/cm2, the rest with 30 mJ/cm2

 

 

4.

Post exposure bake (Program: 1)

 

 

 

 

 

 

5.

Develop (Program: 1)

 

 

 

 

 

 

6.

Inspect, picture:

 

 

 

 

 

 

7.

Descum

 

 

 

This step was skipped since there was no 6 tool for it.

 

 

 

 

 

 

8.

Hard Bake (oven)