Run Card for cmos150

 

Step 25.0

 

 

 

 

 

Process:  Poly Gate Photo

Date

Operator

 

 

 

 

 

Standard I-line Process

 

 

 

 

 

 

1.

HMDS

1/10/02

vorosl, johnkcp

 

Program: 1 on svgcoat6

 

 

 

 

 

 

2.

Spin and Soft Bake

1/10/02

vorosl, johnkcp

 

Program: 7 and 1 on svgcoat6

 

 

 

photoresist: UV210-0.6 (Shipley)

 

 

 

Thickness of PR= 4200 Å

 

 

 

 

 

 

3.

Focus-Exposure Matrix Test

Focus offset: 1.2

Energy= 20 mJ/cm^2

Minimum feature resolved= 0.3 micron