Run Card for cmos150

 

Step 22.0

 

 

 

 

 

Process: P-Channel Punchthrough and Threshold Adjustment Photo: Mask PVT

Date

Operator

 

 

 

 

 

Standard Lithography Process

 

 

 

 

 

1.

HMDS

12/19/01

vorosl

 

Program: 1 on svgcoat6

 

 

 

 

 

 

2.

Spin and Soft Bake

12/19/01

vorosl

 

Program: 1 and 7 on svgcoat6

 

 

 

photoresist: UV26-1.5 (Shipley)

 

 

 

Thickness of PR= 12000

 

 

 

4000 RPM

 

 

 

Soft Bake: 60 sec at 130C

 

 

 

 

 

 

3.

Expose by ASML

12/19/01

vorosl

 

Job name: baseline, energy of light= 30 mJ/cm2

 

 

 

 

 

 

 

 

 

4.

Post Exposure Bake (program:1)

12/19/01

vorosl

 

90 sec at 110C

 

 

 

 

 

 

5.

Develop (program:1)

12/19/01

vorosl

 

 

 

 

6.

Inspect

12/19/01

vorosl

 

 

 

 

7.

Descum

 

 

 

This step was skipped, since there is no 6 tool for it.

 

 

 

 

 

 

8.

Hard Bake (more than 2 hours in the oven, 120 C)

12/19/01

vorosl