1. General Information & Processing
1.1 (chp) Chemical Hygiene Plan
1.4 (computers) Marvell Lab Computers
1.9 VSLI Etchants
1.15 Process Modules
Wafer Cleaning (MOD 1-3)
Manual Lithography (MOD 4-14)
Etching (MOD 15-24)
Miscellaneous (MOD 25-38)
2. Cleaning Procedures
2.1 (msink1) Photoresist Strip & Pre-Furnace Metal Clean Sink
2.2 (msink2) Msink2 PR Strip Sink (General Purpose)
2.3 (msink3) Manual Spin Coat & Develop Sink
2.4 (msink4) KOH and TMAH Silicon Etch
2.5 (msink5) HF Release Sink Operation
2.6 (msink6) VLSI MOS Clean
2.7 (msink7) Msink7
2.8 (msink8) Non-MOS Clean
2.12 (msink12)
2.14 (msink14)
2.16 (msink16) General Purpose Sink
2.18 (msink18) General Purpose Sink
2.20 (cpd) Tousimis 915B Critical-Point Dryer
2.22 (cpdsink)
3. Mask Making
3.1 (cad) Mask Generation Using CAD Software
3.2 (gcaws2) GCA Wafer Stepper Alignment Key Design Guide
3.3 (gcapg) GCA 3600 Pattern Generator
3.4 (aptemul) APT Emulsion Mask Process
3.5 (aptchrome) APT Chrome Mask Process
3.6 (ironoxide) Iron Oxide Mask ProcessinG
3.7 (maskcopy) Ultratech Mask Copier
3.8 (cmos) CMOS Baseline Test Chip
4. Photolithography
4.2 (mixmatch) Mix & Match Process (ASML/GCAWS6 Steppers
Exposure Tools
4.12 (gcaws6) GCA8500 Wafer Stepper (6")
4.13 (gcaws2) GCA6200 Wafer Stepper (4")
4.14 (ksaligner) Karl Suss MA6 Mask Aligner
4.15 (canon) Canon 4X Projection Mask Aligner
4.16 (quintel) Quintel Q4000 Mask Aligner
4.19 (asml300) ASML DUV Stepper Model 5500/300
Photoresist Coat/Dev
4.21 (svgcoat1) SVGCOAT1 6" Photoresist Coat Track
4.22 (svgcoat2) SVGCOAT2 4" Photoresist Coat Track
4.23 (svgcoat3) SVGG-1 4" Photoresist Coat
Track
4.24 (svgcoat6) SVG 8800 6" Coat Track
4.25 (svgdev1) SVGDEV 6" Photoresist Development Track
4.26 (svgdev2) SVGDEV 4" Photoresist Development Track
4.27 (svgdev6) SVG 8800 6" Development Track
4.28 (headway1) Headway Manual Load Photoresist Spinner at msink3
4.29 (headway2) Headway Stand-Alone Manual Load Photoresist Spinner
Others
4.31 (primeoven) HMDS
4.32 (matrix) Matrix 106 Resist Removal System
4.33 (photomsk) Photomask Cleaning (msink10)
4.34 (uvbake) Fusion M150PC Photostabilizer System
4.35 (axcelis) Fusion M200PCU Photostabilizer System
5. Thermal Processing
Furnaces
5.1 (tystar1) Tystar1 MOS Clean Gate Oxidation Atmospheric (4" and 6")
5.4 (tystar4) Tystar4 Atmospheric Dry/Wet Oxidation (NON-MOS)
5.5 (tystar5) Tystar 200mm Wet/Dry Oxidation
5.6 (tystar6) Tystar 200mm N-Type Doping
5.7 (tystar7) Tystar 200mm P-Type Doping
5.10 (tystar10) Tystar10 MOS Clean Polycrystalline Silicon LPCVD (4" and 6")
5.11 (tystar11) Tystar11 MOS Clean LTO LPCVD (4" and 6")
5.12 (tystar12) Tystar12 Non-MOS Clean LTO LPCVD (4" and 6")
5.13 (tystar13) Tystar13 NON-MOS Clean POCl3 Doping (4" and 6")
5.14 (tystar14) Tystar14 Boron+ Doping
5.15 (tystar15) Tystar15 Non-MOS Poly-Silicon Carbide LPCVD (6")
5.16 (tystar16) Tystar16 Non-MOS Poly-Silicon LPCVD
5.18 (tystar18) Tystar18 MOS Clean Aluminum Sintering Atmospheric (4" and 6")
5.19 (tystar19) Tystar19 MOS Clean Si-Ge LPCVD (4" and 6")
5.20 (tystar20) Tystar20 Non-MOS Clean Si-Ge LPCVD (4" and 6")
Rapid Thermal Annealers
5.30 RTP Overview
5.31 (rtp1) AccuThermo AW610 RTP for III/V or PZT
5.32 (rtp2) AccuThermo AW610 RTP III/V -no metal
5.33 (rtp3) AccuThermo AW610 RTP Si Non-MOS
5.34 (rtp4) AccuThermo AW610 RTP Si MOS Clean
5.35 (rtp8) AccuThermo AW810 RTP Si MOS Clean
Ovens
5.36 (vacoven) YES Vacuum Oven
5.41 (nanotube) (Under construction...)
5.42 (compund-ox) (Under construction...)
6. Thin Film Systems
Sputterers
6.1 (hummer) Hummer Sputtering System
6.3 (randex) Randex Sputtering System
6.4 (cpa) CPA Sputtering System
6.5 (aln2) Endeavor AT
6.7 (edwards) Edwards Sputter System
6.8 (gartek) Superconducting Materials Sputtering
6.9 (topgun) Multi-Gun Sputtering System (under construction...)
Evaporator
6.10 (evapclass) Evaporator Overview
6.11 (nrc) NRC Evaporator
6.12 (cha) CHA Solution E-Beam Evaporator
6.13 (dw) Davis & Wilder Evaporator
6.14 (edwardseb3) Edwards EB3 Electron Beam Evaporator
6.15 (ultek) ULTEK E-Beam Evaporator
6.16 (tescal) Technical Eningeering Services Thermal Evaporator
CVD Thin Films
6.22 (parylene) Parylene Deposition System 2010 Labcoater 2
6.23 (amst) AMST Molecular Vapor Deposition System MVD100
6.24 (picosun) Picosun Atomic Layer Deposition (ALD)
6.25 (cambridge) Cambridge ALD Deposition System (under construction...)
6.26 (sp3) sp3 HFCVD Diamond Deposition Reactor
6.27 (amatepi)
6.28 (p5000) Applied P5000
6.29 (oxford2) Oxford Plasmalab 80plus PECVD System
6.31 (iondep) Ion Beam Deposition System (4” and 6”)
6.32 (pqecr) Plasma Quest ECR PECVD System
7. Etching Systems
7.1 (ionmill) Ion Beam Milling With the Veeco Microetch System
7.2 (technics-c) Technics C Plasma Etching System
7.3 (ptherm) Plasma-Therm Parallel Plate Etcher
7.4 (hfvapor) Hfvapor Idonus HF VPE-100/150
7.5 (xetch) Xenon Difluoride Etching System
7.6 (matrix-etch) Matrix Silicon Oxide/Nitride Etcher
7.7 (primaxx) uEtch HF Vapor Release System
7.8 (semi) SEMI RIE System
7.9 (oxford) Oxford RIE System
7.10 LAM Etchers Overview (Under construction...)
7.11 (lam6) Lam6 Oxide Rainbow Etcher
7.12 (lam7) Lam7 Metal (Al) TCP Etcher
7.13 (lam8) Lam8 Poly-Si TCP Etcher
7.20 STS Etchers Overview (Under construction...)
7.21 (sts) STS Poly-Si ICP Etcher
7.23 (sts-oxide) STS-OXIDE
7.30 AMAT Etchers Overview (Under construction...)
7.31 (centura-3-5) Compound Etch Chamber A
7.32 (centura-mxp) MxP+ Etch Chamber B
7.33 (centura-met) Metal Etch Chamber C
7.34 (centura-strip) (Under construction...)
8. Testing & Inspection Equipment
Electrical Measurements
8.1 (4ptprb) Four-Point Probe Resistivity Measurement - Manual
8.3 (iv) I-V Probe Station (Under construction...)
8.4 (probe1) General Probe Station
8.5 (probe2) Rucker & Kolls 667
8.6 (autoprobe) Electroglass Autoprobe in DCL
8.7 (sca) Surface Charge Analyzer
8.8 (cde-resmap) CDE ResMap Four Point Probe (automated mapper 2" -12")
Profilometers
8.11 (asiq) Alpha-Step IQ Surface Profiler
8.12 (afm2) Digital Instrument AFM
8.13 (wyko) Wyko NT3300 Profiling System
8.14 (dektak) Dektak 3030 Surface Profiler
Microscopes/Optical
8.21 (reichert) Reichert Microscope
8.22 (linewidth) Linewidth Measuring System
8.23 (uvscope) Leica INM100 Microscope
8.24 (netscope) Netscope
8.26 (keyence) Keyence VHX-600 Digital Microscope
8.27 (olympus) Olympus LEXT OLS3000 3D Laser Confocal Microscope
Thin Film Measurements
8.31 (rudolph) Rudoph Ellipsometer
8.32 (sopra) Ellipsometer
8.33 (nanospec) NanoSpec Film Thickness Measurement System
8.35 (ellips) Gaetner Stokes Ellipsometer
E-Beam/X-Ray
8.42 (leo) LEO 1550 Scanning Electron Microscope
8.43 (feisem) FEI Nova NanoSEM 650 Scanning Electron Microscope
8.44 (xdif) Siemens D5000 X-Ray Diffractometer
Others
8.51 (sartorius) Sartorius A200S Electronic Analytical Balance
8.52 (flexus) Flexus Thin Film Stress Measurement
8.53 (tensiometer) Tensiometer (KSV Sigma 701)
8.54 (kruss) Contact Angle Measurement System
9. Packaging
9.1 (ksba6) Karl Suss BA6 Bond Aligner
9.2 (ksbonder) Karl Suss SB6 Thermocompression & Anodic Bonder
9.3 (flipchip) Suss Microtech FC150 Flip Chip Bonder
9.4 (westbond,westbond2) Westbond Wirebonder Model 7400B
9.5 (diebonder) Die Bonder
9.6 (disco) Disco DAD3240 Automatic Dicing Saw
10. Planarization
10.1 (cmp) Strausbaugh CMP
10.2 (sinkcmp) CMP Wet Sink
10.3 (gnpcmp) GnP Poli 500 CMP